ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,483, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Semiconductor chip package having internal I/O structures with ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,484, issued on July 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Bonding pad structure and method for manufacturi... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,485, issued on July 21, was assigned to TOWA Corp. (Kyoto, Japan). "Semiconductor device manufacturing method and lead frame" was invented ... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,486, issued on July 21, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Subtractive metal structuring on surface of semicon... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,487, issued on July 21, was assigned to Microsoft Technology Licensing LLC (Redmond, Wash.). "Embedding an electronic component in a core o... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,488, issued on July 21, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Cavity packages" was invented by... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,490, issued on July 21, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Display device including multiple flexible printed circu... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,491, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Method for manufacturing a semiconductor dev... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,492, issued on July 21, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit package with imp... Read More
ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,493, issued on July 21, was assigned to Huawei Technologies Co. Ltd. (Shenzhen, China). "LED chip packaging module, fabrication method ther... Read More